The Picofluidics CDF-Electrochemical Deposition (ECD) system is capable of depositing conventional ECD metallisation at low cost while requiring a small footprint due to the low volume cell design.
Substrates, once placed on a wafer-loading robot, are under PC control until the process cycle is completed.
The system supports multi-step recipes and utilizes maintenance routines to ensure reproducible process performance. All monitored process variables such as current, voltage, time, temperature etc. are data-logged to aid development or fault finding activities.
Wafer sizes up to 300mm can be processed while wafer pieces can be supported through the use of carrier wafers.
|Process wafer pieces to full wafers (300mm) with no hardware changes.||Process development can be carried out on pieces and rapidly transferred to full wafers.|
|Small volume process chamber.||Low chemical usage and storage. Small footprint.|
|Process fluids can be stored in the system.||Small footprint. Simple installation.|
|Automated process control with multi-step recipes and data-logging.||Reproducible process performance.|
Process Capabilities: 3-D packaging applications. Eg. High aspect ratio Cu TSV fill, RDL etc.